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        RH170

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        产品描述

        RH170

         

         

        (UL ANSI:FR-4.1)High Performance,High Tg Halogen-free

         

        特点            

        1. 无铅兼容FR-4
        2. 高Tg无卤,UV Blocking/AOI兼容
        3. 不含卤素、砷、红磷等成份。

        应用领域            
        通信设备、计算机、仪器仪表、录像机、电视机、电子游戏机等。

         

         FEATURES     

        1. Lead-free compatible FR-4
        2. High Tg Halogen-free ,UV Blocking/AOI compatible
        3. Free of constituents such as halogen,animony,red phosphorous,ect.

         APPLICATIONS     
        Communication equipment , computer , instrumentation , VCR , TV , electronic game machine , and etc .

         

        GENERAL PROPERTIES    

        Test Item

        Test condition

        Units

        Standard value

        Typical value

        1.Peel Strength , IBS/IN,Minimum,1 OZ

         

        IBS/IN

         

         

        As received

        A

        ≥8.0

        10.7

        After thermal stress

        A

        ≥8.0

        10.7

        2. Volume resistivity ,Minimum
        At elevated temperature E-24/125

        E-24/125

        MΩ.cm  

        ≥103

        ≥106

        3. Surface resistivity , Minimum                              
        At elevated temperature E-24/125        

         E-24/125

        ≥103

        ≥106

        4.Water absorption , Maximum

        E-1/105+des

        %

        ≤0.50

        0.12

        5.Dielectric Breakdown, Minimum

        D-48/50 D-0.5/23

        Kv

        ≥40

        44

        6. Flexural strength ,Minimum

         

        Mpa

         

         

        Length direction

        A

        ≥415

        580

        Cross direction

        A

        ≥345

        460

        7.Arc resistance ,Minimum

        D-48/50
        D-0.5/23

        S

        ≥60

        165

        8.Flammability

        A

        S

        UL-94V0

        UL-94V0

        9. Permittivity 1MHZ ,Maximum

        A

         

        ≤5.4

        4.6

        10.Loss tangent 1MHZ ,Maximum

        A

        ---

        ≤0.035

        0.013

        11.Thermal stress 288℃,10sec( Minimum )                    

         

        ---

         

         

        Non etched specimen

        A

        NO DEFECT

        NO DEFECT

        Etched

        A

        NO DEFECT

        NO DEFECT

        12. TG(DSC,℃)

        A

        ≥170

        172

        13.CTE(Z-axis)

        Before Tg

        PPM/℃

        ≤60

        35

        After Tg

        PPM/℃

        ≤300

        242

        50-260℃

        %

        ≤3.5

        2.8

        14.T260

        TMA

        min

        ≥30

        60

        Note:
        the treatment of letters and numerical meaning
            A - plate delivery stage
            D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

                                 Warpage of                                                                                        Warpage of

                                (No-treating)                                                                                       (After treating:125℃ 2hr)

                                                           

         

                          Peel strength

                               

          ※Specimen T hickness:1.6mm single side board

         

        PURCHASING INFORMATION    

         

        Thickness

        Copper foil

        Standard Size

        0.2mm  to  3.4mm

        12μm  to    105μm

        1041×1245mm(41″×49″)    940×1245mm(37″×49″)
        1092×1245mm(43″×49″)    

        ※ Other sheet size and thickness could be available upon request.

         

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