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        RH150

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        产品描述

        RH150

         

        (UL ANSI:FR-4.1)High Performance,Mid-Tg Halogen-free

         

        特点            

        1. 不含卤素、砷、红磷等成份
        2. 优良的机械加工性能和热性能,适用于无铅工艺

        应用领域            
        手机、便携式电子产品、笔记本电脑、检测设备、通信、网络设备

         

         FEATURES     

        1. Free of constituents such as halogen,animony,red phosphorous,ect。
        2. Excellent mechanical processibility and thermal resistance,lead free process compliancy。

         APPLICATIONS     
        Mobile phone,portable electronics,notebook and PC, QA equipment, communications,network equipment

         

        GENERAL PROPERTIES    

        Test Item

        Test condition

        Units

        Standard value

        Typical value

        1.Peel Strength , IBS/IN,Minimum,1 OZ

         

        IBS/IN

         

         

        As received

        A

        ≥8.0

        10.8

        After thermal stress

        A

        ≥8.0

        10.8

        2. Volume resistivity ,Minimum
        At elevated temperature E-24/125

        E-24/125

        MΩ.cm  

        ≥103

        ≥107

        3. Surface resistivity , Minimum                              
        At elevated temperature E-24/125        

         E-24/125

        ≥103

        ≥107

        4.Water absorption , Maximum

        E-1/105+des

        %

        ≤0.50

        0.15

        5.Dielectric Breakdown, Minimum

        D-48/50 D-0.5/23

        Kv

        ≥40

        43

        6. Flexural strength ,Minimum

         

        Mpa

         

         

        Length direction

        A

        ≥415

        580

        Cross direction

        A

        ≥345

        460

        7.Arc resistance ,Minimum

        D-48/50
        D-0.5/23

        S

        ≥60

        160

        8.Flammability

        A

        S

        UL-94V0

        UL-94V0

        9. Permittivity 1MHZ ,Maximum

        A

         

        ≤5.4

        4.8

        10.Loss tangent 1MHZ ,Maximum

        A

        ---

        ≤0.035

        0.011

        11.Thermal stress 288℃,10sec( Minimum )                    

         

        ---

         

         

        Non etched specimen

        A

        NO DEFECT

        NO DEFECT

        Etched

        A

        NO DEFECT

        NO DEFECT

        12. TG(DSC,℃)

        A

        ≥150

        152

        13.CTE(Z-axis)

        Before Tg

        PPM/℃

        ≤60

        45

        After Tg

        PPM/℃

        ≤300

        240

        50-260℃

        %

        ≤3.5

        2.9

        14.T260

        TMA

        min

        ≥30

        60

        Note:
        the treatment of letters and numerical meaning
            A - plate delivery stage
            D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

                                       Warpage of                                                                               Warpage of

                                      (No-treating)                                                                               (After treating:125℃ 2hr)

                        

                                 Peel strength

                  

          ※Specimen T hickness:1.6mm single side board

        PURCHASING INFORMATION    

        Thickness

        Copper foil

        Standard Size

        0.2mm  to  3.4mm

        12μm  to    105μm

        1041×1245mm(41″×49″)    940×1245mm(37″×49″)
        1092×1245mm(43″×49″)    

        ※ Other sheet size and thickness could be available upon request.

         

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