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        RL150

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        产品描述

        RL150

         

         

        (UL ANSI:FR-4.0)Mid-Tg Lead-Free /UV Blocking

         

        特点            

        1. Tg ≥150℃无铅兼容FR-4板材
        2. UV Blocking/AOI兼容
        3. 优良的机械加工性能
        4. 优秀的耐CAF性能

        应用领域            
        电脑、仪器仪表、摄像机、通讯设备、
        电子游戏机、汽车等

         

         FEATURES     

        1. Tg ≥ 150 ℃ lead-free compatible FR-4 board
        2. UV Blocking/AOI Compatible
        3. Excellent machinability processability 
        4. Excellent Anti-CAF Performance

         APPLICATIONS     
        Computer,lnstrumentation,VCR,communication equipment,electronic game machine,automotive electronics,and etc。

         

        GENERAL PROPERTIES    

        Test Item

        Test condition

        Units

        Standard value

        Typical value

        1.Peel Strength , IBS/IN,Minimum,1 OZ

         

        IBS/IN

         

         

        As received

        A

        ≥8.0

        12.6

        After thermal stress

        A

        ≥8.0

        12.6

        2. Volume resistivity ,Minimum
        At elevated temperature E-24/125

        E-24/125

        MΩ.cm  

        ≥103

        ≥106

        3. Surface resistivity , Minimum                              
        At elevated temperature E-24/125        

         E-24/125

        ≥103

        ≥106

        4.Water absorption , Maximum

        E-1/105+des

        %

        ≤0.50

        0.13

        5.Dielectric Breakdown, Minimum

        D-48/50 D-0.5/23

        Kv

        ≥40

        43

        6. Flexural strength ,Minimum

         

        Mpa

         

         

        Length direction

        A

        ≥415

        520

        Cross direction

        A

        ≥345

        450

        7.Arc resistance ,Minimum

        D-48/50
        D-0.5/23

        S

        ≥60

        140

        8.Flammability

        A

        S

        UL-94V0

        UL-94V0

        9. Permittivity 1MHZ ,Maximum

        A

         

        ≤5.4

        4.9

        10.Loss tangent 1MHZ ,Maximum

        A

        ---

        ≤0.035

        0.016

        11.Thermal stress 288℃,10sec( Minimum )                    

         

        ---

         

         

        Non etched specimen

        A

        NO DEFECT

        NO DEFECT

        Etched

        A

        NO DEFECT

        NO DEFECT

        12. TG(DSC,℃)

        A

        ≥150

        152

        13. CTI,V

        TEC-112

        V

        ≥175

        200

        Note:
        the treatment of letters and numerical meaning
            A - plate delivery stage
            D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

                                Warpage of                                                                              Warpage of

                                (No-treating)                                                                             (After treating:125℃ 2hr)

                                                  

                                Peel strength

                                   

          ※Specimen T hickness:1.6mm single side board

        PURCHASING INFORMATION    

         

        Thickness

        Copper foil

        Standard Size

        0.2mm  to  3.4mm

        12μm  to    105μm

        1041×1245mm(41″×49″)    940×1245mm(37″×49″)
        1092×1245mm(43″×49″)   

        ※ Other sheet size and thickness could be available upon request.

         

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